Project Overview
Intel Corporation required specialized support equipment to assist their developers in signal monitoring and control for various platforms. The APS3 project, aimed to enhance development accuracy and efficiency across Intel’s global research and development sites. The equipment had to meet Intel’s stringent performance and quality standards while being produced at scale.
Implementation Strategy
To meet Intel’s requirements, Michmas Electronics adopted a ‘Build-to-Print approach, providing a Full Turnkey solution that covered the entire production process. This included sourcing components, designing custom enclosures, and delivering a fully integrated product.
- Michmas began by identifying and acquiring high-quality components that matched Intel’s strict technical specifications.
- Advanced assembly methods were employed to ensure exceptional reliability for each unit. Custom-designed enclosures were fabricated using injection molding to enhance the durability and usability of the product.
- The engineering team ensured seamless mechanical integration by precisely assembling electronic components, enclosures, and specialized cable sets to produce a cohesive final product.
- To guarantee product performance, the units underwent thorough functional testing and quality assurance. Additionally, the team developed protective and branded packaging solutions.
- To support international shipment. Michmas then coordinated global logistics to ensure timely delivery to Intel’s development centers and partners worldwide.
Outcome
The APS3 project resulted in the annual production of thousands of units, significantly improving Intel’s ability to test and refine its platforms. Michmas Electronics’ efficient process allowed Intel to expand its research and development capabilities. Globally, reinforcing the company’s reputation for delivering high-volume, complex projects with precision and reliability.